Thermal Issues References

1
Thermal Issues References

• Thermal considerations in cooling large scale
  high compute density data centers Patel, C.D.
  Sharma, R. Bash, C.E. Beitelmal, A. Termal and
  Thermomechanical Phenomena in Electronic Systems,
  2002. ITHERM 2002. The Eighth Intersociety
  Conference on , 2002, Page(s) 767 -776
• A system design approach to liquid-cooled
  microprocessors, Dickinson, R.D. Novotny, S.
  Vogel, M. Dunn, J. Thermal and Thermomechanical
  Phenomena in Electronic Systems, 2002. ITHERM
  2002. The Eighth Intersociety Conference on ,
  2002, Page(s) 413 -420
• Packaging the Itanium microprocessor Hong Xie
  Watwe, A. Yusuf, I. Cherukuri, N.
  Brandenburger, P. Kay, A. Chandran, B.
  Electronic Components and Technology Conference,
  2002. Proceedings. 52nd , 2002, Page(s) 583 589
• High performance package designs for a 1 GHz
  microprocessor , Hasan, A. Sarangi, A.
  Baldwin, C.S. Sankman, R.L. Taylor, G.F.
  Advanced Packaging, IEEE Transactions on, Volume
  24 Issue 2 , Nov. 2001, Page(s) 470 -476

2
Thermal Issues References

• The IA-64 Itanium processor cartridge, Samaras,
  W.A. Cherukuri, N. Venkataraman, S. IEEE Micro
  , Volume 21 Issue 1 , Jan.-Feb. 2001, Page(s)
  82 -89
• Novel thermal validation metrology based on
  non-uniform power distribution for Pentium(R) III
  Xeon cartridge processor design with integrated
  level two cache Teck Joo Goh Amir, A.N.
  Chia-Pin Chiu Torresola, J. Electronic
  Components and Technology Conference, 2001
  Proceedings., 51st , 2001, Page(s) 1181 -1186
• An accelerated reliability test method to
  predict thermal grease pump-out in flip-chip
  applications Chia-Pin Chiu Biju Chandran
  Mello, K. Kelley, K. Electronic Components and
  Technology Conference, 2001. Proceedings., 51st ,
  2001, Page(s) 91 -97
• Characterization of laminar jet impingement
  cooling in portable computer application
  Guarino, J.R. Manno, V.P. Semiconductor Thermal
  Measurement and Management, 2001. Seventeenth
  Annual IEEE Symposium , 2001 Page(s) 1 -11

3
Thermal Issues References

• Study of heatsink grounding schemes for GHz
  microprocessors Radhakrishnan, K. Wittwer, D.
  Yuan-Liang Li Electrical Performance of
  Electronic Packaging, 2000, IEEE Conference on. ,
  2000 Page(s) 189 -192
• Reliability of commercial plastic encapsulated
  microelectronics at temperatures from 125C to
  300C McCluskey, P. Mensah, K. O'Connor, C.
  Lilie, F. Gallo, A. Fink, J. Aerospace
  Conference Proceedings, 2000 IEEE , Volume 5 ,
  2000 Page(s) 445 -450 vol.5
• Packaging technology for high performance CMOS
  server Fujitsu GS8900 Fujisaki, A. Suzuki, M.
  Yamamoto, H. Electronic Components Technology
  Conference, 2000. 2000 Proceedings. 50th , 2000
  Page(s) 920 -924
• High performance package designs for a 1 GHz
  microprocessor Hasan, A. Sarangi, A. Baldwin,
  C.S. Sankman, R.L. Taylor, G.F. Electronic
  Components Technology Conference, 2000. 2000
  Proceedings. 50th , 2000 Page(s) 1178 -1184
• Application of phase-change materials in Pentium
  (R) III and Pentium (R) III Xeon processor
  cartridges Chia-Pin Chiu Solbrekken, G.L.
  LeBonheur, V. Xu, Y.E. Advanced Packaging
  Materials Processes, Properties andInterfaces,
  2000. Proceedings. International Symposium on ,
  2000 Page(s) 265 -270

4
Thermal Issues references

• Cartridge thermal design of Pentium/sup (R)/ III
  processor for workstation giga hertz technology
  envelope extension challenges Teck Joo Goh
  Amir, A.N. Chia-Pin Chiu Torresola, J.
  Electronics Packaging Technology Conference,
  2000. (EPTC 2000). Proceedings of 3rd , 2000
  Page(s) 65 -71
• Integrated heat sink-heat pipe thermal cooling
  device Yusuf, I. Watwe, A. Ekhlassi, H.
  Thermal and Thermomechanical Phenomena in
  Electronic Systems, 2000. ITHERM 2000. The
  Seventh Intersociety Conference on , 2000
  Page(s) 27 -30 vol. 2
• Refrigeration technologies for sub-ambient
  temperature operation of computing
  systemsGhoshal, U. Schmidt, R. Solid-State
  Circuits Conference, 2000. Digest of Technical
  Papers. ISSCC. 2000 IEEE International , 2000
  Page(s) 216 -217, 458
• Low temperature CMOS experience at IBM Schmidt,
  R. Semiconductor Thermal Measurement and
  Management Symposium, 2000. Sixteenth Annual IEEE
  , 2000 Page(s) 112 -113
• Heat spreader attach a microprocessor thermal
  solution Starr, O. Master, R.N. Khan, M.Z.
  Tain, A. Ding, D.H. Juwanda, A. Electronic
  Components and Technology Conference, 1999. 1999
  Proceedings. 49th , 1999 Page(s) 238 -242

5
Thermal Issues references

• The development of component-level thermal
  compact models the Motorola PowerPC 603 and
  PowerPC 604 RISC microprocessors Parry, J.
  Rosten, H. Kromann, G.B. Components, Packaging,
  and Manufacturing Technology, Part A, IEEE
  Transactions on, Volume 21 Issue 1 , March 1998
  Page(s) 104 -112
• Influence of Temperature on Microelectronics and
  System Reliability A Physics of Failure
  Approach ISBN 0849394503, 1997 Pradeep Lall
  Michael Pecht Edward B Hakim
• Temperature Measurement ISBN 080198385
  1993Bela G Lintak
• Air Cooling Technology for Electronic Equipment
  ISBN 0849394473 1996 Sung Jin Kim Sang Woo
  LeeThe Electronic Packaging Handbook ISBN
  0849385919 1999 Glenn R Blackwell
• Thermal Design of Electronic Equipment ISBN
  0849300827 2000 Ralph Remsburg
• Thermal Measurements in Electronics Cooling
  ISBN 0849332796 1997 Kaveh Azar

6
TEC references

• D.M. Rowe. CRC Handbook of Thermoelectronics
  CRC Press, 1995.
• B.J. Huang et al. A design method of
  thermoelectric cooler International Journal of
  Refrigeration, 2000.
• J.A. Chavez et al. SPICE Model of Thermoelectric
  Elements Including Thermal Effects IEEE, 2000.
• Piotr Dziurdzia and Andrzej Kos. Tool for Fast
  Modeling Active Heat Sink, Seventeenth
  SEMI-THERM Symposium, 2001.
• Piotr Dziurdzia and Andrzej Kos. High Efficiency
  Active Cooling Systems, Sixteenth SEMI-THERM
  Symposium, 2000.

7
Power modeling references

• Brooks, et al. Wattch a framework for
  architectural-level power analysis and
  optimizations Proceedings of the 27th
  International Symposium on Computer Architecture,
  June, 2000
• Brooks, D, et al. New methodology for
  early-stage, microarchitecture-level
  power-performance analysis of microprocessors,
  IBM Journal of RD, Vol 47, No. 5/6, 2003.
• Gunther, et al. Managing the Impact of
  Increasing Microprocessor Power Consumption,
  Intel Technology Journal, Q1, 2001
• Ponomarev, et al. , AccuPower An Accurate Power
  Estimation Tool for Superscalar
  Microprocessors", DATE'02, March 2002.
• Ye, et al., The Design and Use of SimplePower A
  Cycle-Accurate Energy Estimation Tool, DAC2000.
• Dhodapkar, et al., TEMPEST A thermal enabled
  multi-model power/performance estimator, In
  Proceedings of the Workshop on Power-Aware
  Computer Systems, 2000.

8
Thermal management references

• A thermal-aware superscalar microprocessor Chee
  How Lim Daasch, W.R. Cai, G. Quality
  Electronic Design, 2002. Proceedings.
  International Symposium on , 2002 Page(s) 517
  -522
• Kevin Skadron et al. Control-Theoretic
  Techniques and Thermal-RC Modeling for Accurate
  and Localized Dynamic Thermal Management
  Proceedings of the Eighth International Symposium
  on High-Performance Computer Architecture, Feb.
  2-6, 2002.
• Dynamic thermal management for high-performance
  microprocessors Brooks, D. Martonosi, M.
  High-Performance Computer Architecture, 2001.
  HPCA. The Seventh International Symposium on ,
  2001 Page(s) 171 -182

9
Clustering References

• R.I. Bahar S. Manne, Power and Energy Reduction
  Via Pipeline Balancing in Proceedings. 28th
  Annual International Symposium on Computer
  Architecture, 2001
• A. Baniasadi, and A. Moshovos, Instruction
  Distribution Heuristics for Quad-Cluster,
  Dynamically-Scheduled, Superscalar Processors,
  Proc. 33rd. Intl. Symp. on Microarchitecture
  (MICRO-33)
• R. Canal, J.M. Parcerisa, A. Gonzalez. A
  Cost-Effective Clustered Architecture. In Proc.
  of the Int. Conf. on Parallel Architectures and
  Compilation Techniques, 1999
• R. Canal, J.M. Parcerisa, A. González Dynamic
  Cluster Assignment Mechanisms in Proc. of the
  Sixth International Symposium on High-Performance
  Computer Architecture, 2000. HPCA-6)
• P. Chaparro, J. González, A. González
  Thermal-Effective Clustered Microarchitectures
  First Workshop on Thermal Aware Computer Systems
  (TACS-2004), 2004
• K.I. Farkas, P. Chow, N.P. Jouppi, Z. Vranesic,
  The Multicluster Architecture Reducing Cycle
  Time Through Partitioning, in Proc. of the 30th.
  Ann. Symp. on Microarchitecture, December 1997,
  pp149-159

10
Clustering References

• J. González, A. González Dynamic Cluster
  Resizing Computer Design, 2003. Proceedings.
  21st International Conference on , ICCD 03
• J. González, F. Latorre, A. González Cache
  Organizations for Clustered Microarchitectures
  3rd Workshop on Memory Performance Issues
  (WMPI-2004), 2004
• S. Heo, K. Barr, K. Asanovic Reducing Power
  Density Through Activity Migration Proceedings
  of the 2003 International Symposium on Low Power
  Electronics and Design, 2003 (ISLPED '03)
• G.A. Kemp, M. Franklin, PEWs A Decentralized
  Dynamic Scheduler for ILP Processing, in Proc.
  of the Int. Conf. on Parallel Processing. 1996,
  v.1, pp 239-246
• S. Palacharla, N.P. Jouppi, and J.E. Smith,
  Complexity-Effective Superscalar Processors, in
  Proc of the 24th. Int. Symp. on Comp.
  Architecture, 1997, pp 1-13
• J.M. Parcerisa, A. González, J.E. Smith, A
  Clustered Front-End for Superscalar Processors 
  Technical Report UPC-DAC-2002-29, 2002
• J.M. Parcerisa, J. Sahuquillo, A. González, J.
  Duato Efficient Interconnects for Clustered
  Microarchitectures, Proc. of the International
  Conference on Parallel Architectures and
  Compilation Techniques, 2002.

11
Clustering References

• S.S. Sastry, S. Palacharla, J.E. Smith,
  Exploiting Idle Floating-Point Resources For
  Integer Execution, in Proc. of the Int .Conf. on
  Programming Lang. Design and Implementation.
  Montreal, 1998.
• V.V. Zyuban, Kogge, P. M. Inherently Lower-Power
  High-Performance Superscalar Architectures, IEEE
  Transactions on Computers 2001

12
Power Distribution References

• D.J. Herrell and B. Beker. Modeling of power
  distribution systems for high-performance
  microprocessors, IEEE Transactions on Advanced
  Packaging, vol. 22, no. 3, pp. 240-248, Aug.
  1999.
• M.D. Pant, P. Pant, D.S. Wills, V. Tiwari.
  Inductive Noise reduction at the architectural
  level, Proceedings of the 13th Int'l Conference
  on VLSI Design, Jan. 2000.
• E. Grochowski, D. Ayers, and V. Tiwari.
  Microarchitectural simulation and control of
  di/dt-induced power supply voltage variation,
  HPCA8, Feb. 2002.
• R. Joseph, D. Brooks, M. Martonosi. Control
  techniques to EliminateVoltage Emergencies in
  High Performance Processors, HPCA9, Feb. 2003.
• M. Powell and T. N. Vijaykumar, Pipeline
  Damping A Microarchitectural Technique to Reduce
  Inductive Noise in Supply Voltage, ISCA30, June
  2003
• R. Joseph, Z. Hu, and M. Martonosi, "Wavelet
  Analysis for Microprocessor Design Experiences
  with Wavelet-Based dI/dt Characterization" HPCA,
  February 2004.
• M. Powell and T. N. Vijaykumar. Exploiting
  Resonant Behavior to Reduce Inductive Noise,
  ISCA2004.
• K. Hazelwood and D. Brooks. Eliminating Voltage
  Emergencies via Microarchitectural Voltage
  Control Feedback and Dynamic Optimization ,
  ISLPED2004.