kSA BandiT: Band-edge Thermometry - PowerPoint PPT Presentation

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kSA BandiT: Band-edge Thermometry

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kSA BandiT: Band-edge Thermometry Band-edge Thermometry Principles Semiconductors: transparent for h = Eg Semiconductors: as substrate ... – PowerPoint PPT presentation

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Title: kSA BandiT: Band-edge Thermometry


1
kSA BandiT Band-edge Thermometry
2
Band-edge Thermometry Principles
  • Semiconductors transparent for h? lt Eg, opaque
    for h? gt Eg
  • Semiconductors as substrate temperature
    increases, Eg ? and ?g ?
  • Look at diffusely scattered light component not
    the specular component. Specularly reflected
    (front surface) light does not interact with the
    wafer.

3
Band-edge Thermometry vs. Pyrometers
  • Pyrometers
  • Typically inaccurate or no measurement below
    400-450oC
  • Potential interference from stray IR (esp. at low
    Ts), internal reflections (heterojunctions),
    coated view ports
  • Absolute temperature calibration from machine to
    machine is difficult
  • Eg thermometers
  • Need good light collection detection system
  • Need good normalization fitting software
  • Absorbing over layers limit thickness for
    temperature measurement

4
kSA BandiT vs. Competitor Instruments
  • State-of-the-art solid state spectrometer - 1000x
    more sensitivity and no moving parts (longer
    lifetime, no need for constant recalibration)
  • Excellent S/N without a chopper
  • Efficient collection optics
  • Powerful software and full software development
    team
  • Operates in either transmission or reflection
    mode
  • Single USB connection to laptop computer
  • Full technical service and support

5
kSA BandiT Product Specifications
  • BandiT System Schematic

6
BandiT Light Source
kSA BandiT Product Specs. Contd
  • 150W halogen lamp with gold coated parabolic
    reflector.
  • Light source collimating optics.
  • Real-time output power control via BandiT
    software.
  • Internal feedback control for stable intensity
    and spectral output.
  • NOTE above 300 oC can use heater as light
    source

7
BandiT Detector
kSA BandiT Product Specs. Contd
  • 2-inch collection optics focusing to 400 um
    fiber.
  • Single-axis gimble mount for radial scanning
    between inner/outer platen rings
  • Dual fiber with visible laser for easy
    alignment.

8
kSA BandiT Product Specs. Contd
  • Spectrometer
  • Visible Model (B-VIS)
  • 512x64 element Peltier-cooled CCD array detector
  • Wavelength Range 380 nm 1100 nm or custom
  • SiC, ZnTe, ZnSe substrates
  • NIR Model (B-NIR)
  • 128 element InGaAs temperature stabilized
    photodiode array with on-board interpolation
    yields 1024 elements
  • Wavelength Range 875 nm 1400 nm
  • GaAs, Si, InP substrates

9
kSA BandiT Software
  • Full hardware control and real-time feedback of
    lamp and spectrometer
  • Powerful, flexible fitting algorithms
  • Ability to store full, partial, or no spectra and
    temperature data
  • Full analog and digital I/O capability
  • USB interface, runs from a laptop

10
kSA BandiT Performance Specifications

1 B-VIS model
2 B-NIR model
11
BandiT Stability Data GaAs _at_ 300C
12
kSA BandiT Performance Specs (contd)
  • Noise from rotation 1-2oC for all size wafers
  • Pyrometer noise typically much worse for ¼ X 3
    pieces
  • No interference from
  • hot sources
  • highly doped epi (2um of GaAsC, p 6.5e19/cm3)
  • high-on-low Eg growth (AlGaAs/GaAs)
  • Low-on-high Eg growth InGaAs/InP
  • InGaAs strong IR absorber
  • Clean measurement thru 1.2 um of epi (using
    heater only)

13
kSA BandiT Calibration File Generation
  • material
  • thickness
  • dopant level

Calibration depends on
14
BandiT, TC, and Pyro Measurement
GaAs Oxide Desorption
Pyro reads high at low temps because substrate is
transparent
15
Interference Oscillations
Oscillations in temperature
16
Low Temp GaAs Growth
TC does not see temp rise due to As Absorption
Temp increase due to As absorption
17
BandiT Measurement During Substrate
RotationSpatially Resolved Wafer Temperature
  • Speed of solid state spectrometer provides
    spatially resolved temperature across all wafers
  • Wafer temperature can vary widely depending on
    thermal contact with holder
  • Temperature uniformity across each wafer
    depends on holder mechanism
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