Substrate Fabrication for Printed Circuit Boards

1
Substrate Fabrication for Printed Circuit Boards

• Rania Khan
• Summer 2005

2
Introduction

• Background
• Make-up
• Single, Double, and Multilayer boards
• Clean Room Environment
• Class 1000
• Equipment

3
Photo Resist

• Types
• Positive/negative
• Liquid/dry
• Spin Coating/Laminating
• Exposing
• Developing
• Role during Plating
• Stripping

Spin Coater
4
Process

• Subtractive Process
• Heat Press
• Apply, Expose, and Develop Photo Resist
• Etch Copper
• Strip Photo Resist
• Additive Process
• Electroless Copper
• Apply, Expose, and Develop Photo Resist
• Electrolytic Copper
• Strip Photo Resist and Etch Electroless Copper

5
Subtractive Plating Method
6
Additive Plating Method
7
Analyzing and Testing

• Cross-sectioning
• Electrolytic and Electroless Chemical Make-up
• Measuring Thickness

Dektak Profilometer