PCB

1
Printed Circuit Board Presentation For AMS-02
Project
Fu-Hsiang Wang CSIST Dec.3, 2003
2
Status of PCB production for AMS
3
Status of PCB production for AMS(continued)
4
The JBP board manufacturing Failure Explanation

• We had made 3 JBP boards, but all failed
  because the 4 mil lines were found deformed or
  broken. And from the photos listed below we guess
  the possible causes are as follow
• The brush pressure is too large (The thick the
  board is, the lower value should be used).
• The peel strength of 4 mil lines might be less
  than expected.

5
Failure Explanation
6
Failure Explanation
7
Failure Explanation
Photo 5 JBP Board 3 L1-line broken
8
Improvements suggested to JBP board manufacturing

• Using suitable brush pressure
• Check peel strength of copper foil after
  laminated
• Changing outer layers lamination mode (L1 L12)
  
• Expand the line width and space if possible (To
  increase yield and simplify manuf.)

9
Improvements suggested to JBP board manufacturing
(Copper foil) L1
(copper clad laminated) Prepreg L2 L3
copper clad laminated Prepreg L4 L5 copper clad
laminated Prepreg L6 L7 copper clad
laminated Prepreg L8 L9 copper clad
laminated Prepreg L10 L11 copper clad
laminated Prepreg (Copper foil)
L12 (copper clad
laminated) Present lamination
Suggested lamination
10
Change the cPCI connectors Assembly type to
Press-In