Students ST Belgium RF Applied Design Center

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Students ST BelgiumRF Applied DesignCenter

• Roberto Antonicelli ST Belgium,
  Network Division
• May 5th, 2004

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• The RF Applied Designcompetence cluster

Perform product-oriented RD in RF Applied Design
and leverage the knowledge to develop and
optimise best-in-class wireless front-ends
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• Create synergy among ST experts and gather
  spread know-how
• Set up a database of methods, algorithms, rules
  and solutions
• Adhere to multimode design to enable reuse
• Interface to external layers
• Leverage key relationships with the Polytechnic
  of Bari
• Balance activities between BU needs and
  long-term outcomes

• Our vision

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• Main objectives

• RF circuit design
• Printed antennas
• RF Board design
• Support activities
• Simulation tools

Internship Projects
Enabling RF
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• RF board design

• Main objectives

• Standard daughter / mother board design and
  layout for RD evaluation purposes
• Socket daughter board design for ATE test
• Customer oriented board design forRD evaluation
  purposes (minimum BOM, external voltage
  regulator, top-only SMT components, minimum size,
  )
• 2-layer board design addressing lightweight,
  low-cost, low-BOM PCBs
• Contribution to demo-boards andmini-kits for
  application purposes

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• Main objectives

• High-speed design

• Investigation on different noise coupling
  mechanisms
• On-board power distribution concepts ground
  bounce induced by power plane resonances
• Power-bus distribution and noise decoupling on
  board
• EMI concepts and radiated emissions
• Simultaneous Switching Noise (SSN) and Signal
  Integrity (SI) analysis
• Measurements and positioning of SMT component
  placement in RF PCBs

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• Printed antennas

• Main objectives

• Analysis and synthesis for 4, 2-layer PCBs
• Simulation of E-, H-plane antenna patterns
• Measurements of input VSWR
• Measurements of induced cross-polarization
  pattern (proximity effects)
• Investigation on availability of
  low-costanechoic chambers

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• RF IC packages

• Main objectives

• Accessing the knowledge in CRD
• Analysis of all complex semiconductor packages
  including flip-chip, chip-scale package, and
  multiple-die system-in-package
• Generation of RLC models and multi-conductor
  coupled SPICE sub-circuitmodel for each lead in
  the package

• Emphasis on
• Substrate design
• Embedding of matching networks in packages

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• On-chip power bus distribution

• Main objectives

• Accessing the knowledge in CRD
• Investigation on different noise coupling
  mechanisms
• Power distribution analysis with suited
  simulation tools

• Emphasis on
• Location of voltage regulatorsand voltage
  references
• Optimization of current pathsand vias with
  special emphasisto digital supply lines

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• Back-end activities

• Main objectives

• Characterization of boards, connectors and
  components
• Matching network systematic design
• Discrete-, microstrip- and stripline- filters and
  baluns
• Experiments in the 1 6 GHz frequency range
• Off-chip LNAs, PAs

• S parameter-based analysis (Smith Chart)
• Measurement of port parameters (input/output
  impedance, VSWR, return loss, )
• Use of linear/nonlinear planar simulators, system
  simulators
• Programmation of instruments (network analyzer)

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• Simulation tools

• Main objectives

• 2D, 2.5D, 3D planar simulators
• Full-wave EM solvers
• Package simulators
• Data import/export
• General assessment and usage

System analysis, circuit design and
electromagnetic simulation, to go into developing
wireless technology, broadband communication
networks and antenna systems.
Analysis of complex printed circuit boards
(PCBs), IC packaging, high-performance
interconnects, and on-chip structures.
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• Human Resources

• Specific projects

Student A1
Student B1
Student B2
Student A2
Training
Self-study
Design
1st iteration
Measurem.
Redesign
2nd iteration
Measurem.
Compilation
Sep
Dec
Mar
Sep
Jun
2003
2004
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• Company policy

Payment
Welcome pack
ST Belgium offers the student a monthly fixed
amount, depending on the nature of the training
and the length of the internship or thesis
project at the firm. This amount is expected to
cover the costs of transport, lunch, etc. Current
amounts are 433.82 / month (NET) for MSEE
619.74 / month (NET) for PhD

• Our organization (an organization chart short
  narrative on the various departments within the
  firm)
• The operating procedures with respect to safety
  (badges, access, etc)
• Working hours
• Payment
• How to reach STMicroelectronics
• List of contacts

Working rules

• 8 hrs./day
• Holidays max 10 days (unpaid)
• Lunch facilities

Housing
Accommodation is up to the student. She or he
will have to find his own apartment. A temporary
solution will be provided for max one month.