Nanoelectronics and embedded intelligence

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• Nanoelectronics and embedded intelligence
• A cluster to face the challenges of the future
• Bernard Fontan
• March 3 2006

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Shift the competitive battle from pure cost
to - innovation cycle acceleration - highest
value in products and services
A global competitive challenge
Vision

• Aggressive competition from low production cost
  continents
• Rapid replication of latest innovations

Industry must provide a triple response to this
challenge

• Create highly differentiated products

• Small power and size
• Smart and connected

• Accelerate the rate of innovation

• Link activities and innovative services with new
  products

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The background in Grenoble

• A strong micro/nano electronic base with the
• CEA Leti/STMicroeletronics/Freescale/ Philips SC
  Alliance
• Start-ups, spin-off from CEA
• Network of research organizations
• A solid basis of software expertise
• Research institutes INRIA, verimag, TIMA,
  industry
• Innovative SME
• Services
• SoC (Embedded systems in silicon) development
  center (ST)

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The background in Grenoble

• A strong micro/nano electronic base with the
• CEA Leti/STMicroeletronics/Freescale/ Philips SC
  Alliance
• Start-ups, spin-off from CEA
• Network of research organizations
• A solid basis of software expertise
• Research institutes INRIA, Verimag, TIMA,
  industry
• Innovative SME
• Services
• SoC (Embedded systems in silicon) development
  center (ST)

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The background in Grenoble

• Industries facing the challenge of global
  competition acceleration
• Large size Schneider Electric
• Medium size in various traditional fields
  textile, paper
• A long local tradition of tight cooperation
  between research, academy and industry
• Public authorities understanding the need to
  provide support to innovation and industry

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Strategy
A two levels strategy

• Strengthen the existing technology basis in
  micro/nanoelectronics and embedded intelligence
• Deploy these technologies in down-steam
  applications domains through Miniaturized Smart
  Solutions bringing differentiating competitiveness

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Three pillars for global competitiveness
Innovative projects to push the edge in
micro/nanoelectronics

• Materials, process technology, manufacturing
  science
• CAD tools and libraries up to functional blocks
• Packaging ,SiP (System in Package)
• Solid state components (MEMS, Détectors,
  flexible substrates)

Applications projects, enabling innovations
through use of Small Smart Solutions

•  Smart Electricity 
• Flexible substrate electronics (textile and
  paper)
• Mobile Multimedia
• Image capture and processing chain

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The partners
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• Thank you!