Institute of Integrated Systems

1
Institute of Integrated Systems
Facilities
Capabilities

• Highlights
• Post-processing CMOS Foundry Wafers
• Integration of LIGA with CMOS
• Integration of MEMS and IC Technology
• Co-location of IC Design with IC Technology
• Optically patterning of 0.35 micron line - spaces
  on 22 x 22mm chips
• Fabrication of membranes, cantilevers
• 200, 150, 100 and 75mm wafer processing
  capability
• 250m2 Class 10) and 250m2 100-1000 cleanrooms for
  micro/nanofabrication and optical assenbly
• Cryogenic test facilities
• Flexure testing facilities (10 Tonnes max)

• Full CMOS processing
• Lithography - 0.35 micron photo (75mm - 200mm),
  e-beam
• Layer Deposition - PECVD, LPCVD, sputtering,
  physical vapour deposition
• Reactive Ion Etching - Chlorine, Fluorine
  chemistries
• Chemical Mechanical Polishing

• MEMS post processing
• Double Sided Alignment
• Deep Reactive Ion Etching
• XeF2 Etch Release
• Critical Point Drying
• Surface Treatment
• Electroplating
• Anodic Bonding
• Wafer Dicing
• Laser Machining
• LIGA

• Analytical Tools
• Microscopy - SEM, TEM, AFM
• Focussed Ion Beam
• Interferometry
• Full Electrical Test Suite
• Spectroscopic Ellipsometer

• Materials
• Conductors
• Aluminium, Gold, Titanium, Nickel, Tantalum,
  Copper, Silver, Titanium Nitride, Tantalum
  Nitride, Carbon Nanotubes
• Dielectrics
• Silicon Oxide, Parylene, Silicon Nitride, Teflon,
  PDMS

• Software Tools
• Agilent IC-CAP Electrical
• Synopsis (Process and Device simulation)
• ANSYS - Mechanical
• COVENTOR - MEMS
• Cadence Design Suite
• FEMLAB

Examples of Device Structures
Physical vapour deposition - High vacuum electron
beam evaporator suitable to deposit 4 different
materials (class 1000 cleanroom)
Etched waffle arrays for submillimeter imaging
detector
Suspended MEMS inductors for wireless
communications applications
Dry etch processed and released resonant devices
in silicon carbide
Optical assembly cleanrooms (class 100
10,0000), cryogenic test and flexure testing
facilities (10 Tonnes max)
Chip repair, Analytical

• Field Emission SEM (Philips XL40FEG)
• EDX analytical FESEM (Hitachi S4500II)
• FIB Workstation (FEI FIB200)
• AFM (Digital Instruments 5000)

Patterned carbon nanotube growth for CNT
electronics
Micromotor using electrostatic actuation to
deliver torque