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week21

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Modern VLSI Design 3e: Chapter 2. Partly from 2002 Prentice Hall PTR. week2 ... Photolithography. Mask patterns are put on wafer using photo-sensitive material: ... – PowerPoint PPT presentation

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Title: week21


1
  • Lecture 4
  • Transistor as Switch
  • Jan. 13 2003

2
Topics
  • Transistor structures.
  • Transistor as a switch

3
Transistor structure
  • n-type transistor

4
The Nobel Prize in Physics 1956
  • William Bradford Shockley
  • Semiconductor Laboratory of Beckman Instruments,
    Inc. Mountain View, CA, USA
  • John Bardeen
  • University of Illinois Urbana, IL, USA
  • Walter Houser Brattain
  • Bell Telephone Laboratories Murray Hill, NJ, USA

5
N Transistor
6
P Transistor
7
Transistor
  • Digital switch
  • Analog many characteristics
  • Example inverter
  • P transistor N transistor one inverter

8
Inverter

out
a
9
Inverter layout

(tubs not shown)
out
a
a
out
10
Example 1

out
b
a
Write the truth Table of this circuit?
11
NAND layout

out
out
b
a
b
a
12
Example 2

Write the truth Table of this circuit?
b
a
out
13
NOR gate

b
a
out
14
NOR layout
b
a
b
out
out
a
15
Difference of digital and analog
  • Digital switch
  • High level
  • Analog characteristics of transistor
  • Low level

16
Example 3
  • Transmission gate

17
  • Lecture 5
  • Transistor Fabrication Process
  • Jan. 15 2003

18
Topics
  • Transistor structure (switch)
  • Basic fabrication steps.

19
Transistor structure
  • n-type transistor

20
Fabrication services
  • Educational services
  • U.S. MOSIS
  • EC EuroPractice
  • Taiwan CIC
  • Japan VDEC
  • Fab companies mainly South Asia

21
Fabrication processes
  • IC built on silicon substrate
  • some structures diffused into substrate
  • other structures built on top of substrate.
  • Substrate regions are doped with n-type and
    p-type impurities. (n heavily doped)
  • Wires made of polycrystalline silicon (poly),
    multiple layers of aluminum (metal).
  • Silicon dioxide (SiO2) is insulator.

22
Simple cross section
SiO2
metal3
metal2
metal1
poly
substrate
n
n
p
substrate
23
What is
  • N and P
  • Substrate
  • Poly
  • Well (tub)
  • Metal
  • Via

24
Photolithography
  • Mask patterns are put on wafer using
    photo-sensitive material

25
Process steps
  • First place tubs to provide properly-doped
    substrate for n-type, p-type transistors

p-tub
p-tub
substrate
26
Process steps, contd.
  • Pattern polysilicon before diffusion regions

gate oxide
poly
poly
p-tub
p-tub
27
Process steps, contd
  • Add diffusions, performing self-masking

poly
poly
p-tub
p-tub
n
n
p
p
28
Process steps, contd
  • Start adding metal layers

metal 1
metal 1
vias
poly
poly
p-tub
p-tub
n
n
p
p
29
Transistor structure
  • n-type transistor

30
Question
  • How many layers?
  • Aluminum or copper?
  • Technology is P-MOS or N-MOS?
  • What is the purpose of silicon?

31
A complete fabrication process
32
Transistor structure (contd)
  • n-type transistor

33
Questions (contd)
  • Order of Poly !!!
  • Self-aligned
  • What is the carrier for N-transistor and
    P-transistor?
  • Complete inverter ?
  • Need metals and vias

34
0.25 micron transistor (Bell Labs)
gate oxide
silicide
source/drain
poly
35
Review
  • N transistor
  • P transistor

36
Examples
  • Switch
  • Fabrication process
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