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ELECTRONICS PRODUCTS PRESENTATION

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VOC-Free. No. 32. All Water-Soluble fluxes classified as: IPC ANSI J-STD 004 Type ORM1. ROSIN FLUXES ... VOC-Free, non-hazardous, OA formulation. ... – PowerPoint PPT presentation

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Title: ELECTRONICS PRODUCTS PRESENTATION


1
SUPERIOR FLUX
MFG. CO.
2
SUPERIOR FLUX MFG. ELECTRONICS PRODUCTS
  • Superior Flux Mfg. Co. founded in 1932.
  • A complete line of primary assembly, touch-up,
    and maintenance products for electronics.
  • 1949 Superior Supersafe No. 30, first Battelle
    formula flux, introduced.
  • 1995 SyberGelTM and SyberLiquidTM introduced for
    repair/rework and hand-soldering.

3
SUPERIOR PRODUCT LINE
  • Solder Pastes
  • Tacky Fluxes
  • Wave Solder Fluxes
  • Component Tinning Fluxes
  • Wire Tinning Fluxes
  • Hand Solder Fluxes
  • Copper and Nickel Pre-Cleaners
  • Detergent/Saponifier
  • Descaler
  • Dross Reduction Powder
  • Omega Meter Test Solution

4
SOLDER PASTE
  • 3000 Series Conventional No-Clean
  • 4000 Series Synthetic, Low-Residue No-Clean
  • 8000 Series Water-Soluble
  • 9000 Series Rosin Mildly Activated (RMA)
  • Solders Tin/Lead,Lead-Free

5
3000 SERIES NO-CLEAN SOLDER PASTE
  • Classification IPC ANSI-J-STD 004, Type ROL0
  • Meets and exceeds Bellcore standards.
  • Pin-testable post-solder joints.
  • Translucent residue.
  • Capable of printing 12 mil pitch.

6
4000 SERIES SYNTHETIC NO-CLEAN SOLDER PASTE
  • Classification IPC ANSI J-STD-004,Type REL0.
  • Meets and exceeds Bellcore standards.
  • Translucent, protective post-solder residue.
  • Pin-testable post-solder joints. General residue
    levels of 2.5 3.3. In proper conditions, can
    be as low as 1.1.
  • Capable of printing 12 mil pitch.

7
8000 SERIES WATER-SOLUBLE SOLDER PASTE
  • Passes Bellcore
  • Passes IPC
  • Residues are truly water-soluble.
  • Post-reflow residues can be left on boards for
    extended time and NOT reduce SIR values.
  • Post-solder residues do not foam in aqueous
    cleaning systems.
  • Capable of printing 12 mil pitch.

8
9000 SERIES RMA SOLDER PASTE
  • Exceptional reflow profiling characteristics.
  • Capable of printing 16 mil pitch.
  • Superior wetting characteristics.
  • Residues can be aqueous cleaned using SyberKleen
    2000 Saponifier.

9
RECOMMENDED REFLOW PROFILE 63Sn/37Pb and
62Sn/36Pb/2Ag
10
REFLOW PROFILE FOR LEAD-FREE
11
APPLICATION METHODS
  • Screen printing
  • Cartridge printing
  • Dispensing

12
WHAT SETS SUPERIOR SOLDER PASTES APART?
  • All are non-halide.
  • All have a minimum 12 hour open-time between
    printing, placement, and reflow.
  • All are formulated for high-speed dispensing.
  • All No-Clean and RMA pastes can be aqueous
    cleaned in Superior SyberKleen 2000 Saponifier .
  • NO slumping.
  • NO tomb-stoning when stencil and reflow profile
    are properly set.
  • NO white residues on PCBs.
  • All Paste should be frozen or refrigerated for
    storage.

13
WHAT SETS SUPERIOR SOLDER PASTES APART? (cont.)
  • Consistent rheology, thixotropy, and viscosity
    from lot-to-lot.
  • Consistent, clear, pin-testable residues with all
    No-Cleans.
  • Consistent metal-load due to no pre-thinning or
    post-thinning manufacturing process.
  • 4000 Series Synthetic No-Clean residues act as
    protective barrier against humidity and outside
    elements.
  • 8000 Series Water-Soluble residues can be washed
    any time after reflow. SIR values remain the
    same when PCBs are cleaned three (3) minutes or
    three (3) days after reflow.

14
SOLDER PASTE STORAGE
  • Shelf life for all solder pastes extended
  • with freezer-storage first formulations.
  • Freezer Storage (0ºC and below) 9-12 months.
  • Refrigerator Storage (1-12ºC) 3-9 months.
  • Room temperature storage (18-23ºC) 3 months.

15
TACKY FLUXES
  • 4000 Synthetic No-Clean
  • 3000 Conventional No-Clean
  • 8000 Water-Soluble
  • 9500 High Temperature
  • Applications
  • BGA Attachment and Repair
  • Custom manufacturing applications
  • Dispensable applications
  • Preform soldering

16
WAVE SOLDERING FLUXES
  • Flux-types
  • No-Clean
  • Water-Soluble
  • RMA
  • Flux-base
  • VOC-FREE
  • Alcohol-based
  • Applications
  • 63Sn/37Pb, 96.5Sn/3.5Ag, 99.3Sn/0.7Cu and other
    alloys.

17
WAVE SOLDERING FLUX APPLICATION METHODS
  • Spray
  • Foam
  • Drag
  • Wave

18
NO-CLEAN WAVE SOLDERING FLUXES
  • VOC-Free
  • No. 420 (Spray or Foam)
  • No. 425
  • Alcohol-based
  • No. 312
  • No. 325
  • No. 340
  • RFE 14Y3N
  • All No-Clean fluxes classified as
  • IPC ANSI J-STD 004 Type ORL0
  • When post-solder cleaning is specified, all
    No-Clean fluxes are
  • water-soluble. No white residues or water-stains.

19
WATER-SOLUBLE WAVE SOLDER FLUXES
  • Alcohol-based
  • No. 84
  • RFE 301-26C
  • VOC-Free
  • No. 32
  • All Water-Soluble fluxes classified as
  • IPC ANSI J-STD 004 Type ORM1

20
ROSIN FLUXES
  • Type R No. 97
  • Type RMA No. 99
  • Type RA No.100
  • Solids content variations are available
  • for all fluxes.

21
ADDITIONAL PCB ASSEMBLY PROCESS PRODUCTS
  • SyberGelTM and SyberLiquidTM
  • Hand solder, repair and rework gel or liquid that
    act as flux and cleaner.
  • Superior SyberKleen 2000 Saponifier
  • Detergent/saponification solution for aqueous
    cleaning systems.
  • Superior Descaler
  • A descaling solution for removing scale residual
    build-up in batch and in-line aqueous cleaners.
  • Superior OMTS
  • A test solution of IPA and DI water for PCB
    testing in Omega Meters.
  • Superior Dross Reducer
  • Powder for dross and oxidation removal from
    solder bath to extend solder life.

22
COMPONENT TINNING PRECLEANERS FLUXES
  • Lead tinning for semiconductor, component, and
    fuse leads.
  • Fluxes formulated for Tin/Lead,
    Lead-Free, and fusible alloys.
  • Base Metals
  • Copper
  • Nickel
  • Alloy 42
  • Alloy 51
  • Kovar
  • Other specialty alloys

23
SEMICONDUCTOR AND COMPONENT LEAD PRE-CLEANERS
  • Copper Pre-Cleaner
  • VOC-Free, non-hazardous, OA formulation.
  • Light, pink color that changes if pH exceeds a
    3.5 reading.
  • Nickel Pre-Cleaner
  • A high activity nickel cleaner that contains no
    sulfuric acid.

24
DIFFERENT FLUXES FOR DIFFERENT APPLICATIONS
  • VOC-FREE, HALIDE
  • No. 30, No. 30DS, No. 40MM4, No. 43
  • ALCOHOL-BASED HALIDE
  • No. 45, No. 48, No. 48S
  • VOC-FREE, NON-HALIDE
  • 430 Series
  • ALCOHOL-BASED, NON-HALIDE
  • No. 435, No. 435 31, No. 91

25
WIRE TINNING FLUXES
  • No-Clean Small gage (14-22) automatic or manual
    cut/strip/tin operations.
  • VOC-Free No. 425
  • Alcohol-based No. 325, No. 334.
  • Water-soluble Large gage (2-12) wires Copper
    and brass crimped terminal wires.
  • VOC-Free No. 30
  • Alcohol-based No. 45
  • Applications
  • Automotive, Industrial, and Appliances.

26
SUPERIOR MANUFACTURES QUALITY SOLDER PASTES AND
FLUXES. OUR BUSINESS IS SOLVING PROBLEMS
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