Title: ELECTRONICS PRODUCTS PRESENTATION
1SUPERIOR FLUX
MFG. CO.
2SUPERIOR FLUX MFG. ELECTRONICS PRODUCTS
- Superior Flux Mfg. Co. founded in 1932.
- A complete line of primary assembly, touch-up,
and maintenance products for electronics. - 1949 Superior Supersafe No. 30, first Battelle
formula flux, introduced. - 1995 SyberGelTM and SyberLiquidTM introduced for
repair/rework and hand-soldering.
3SUPERIOR PRODUCT LINE
- Solder Pastes
- Tacky Fluxes
- Wave Solder Fluxes
- Component Tinning Fluxes
- Wire Tinning Fluxes
- Hand Solder Fluxes
- Copper and Nickel Pre-Cleaners
- Detergent/Saponifier
- Descaler
- Dross Reduction Powder
- Omega Meter Test Solution
4SOLDER PASTE
- 3000 Series Conventional No-Clean
- 4000 Series Synthetic, Low-Residue No-Clean
- 8000 Series Water-Soluble
- 9000 Series Rosin Mildly Activated (RMA)
- Solders Tin/Lead,Lead-Free
53000 SERIES NO-CLEAN SOLDER PASTE
- Classification IPC ANSI-J-STD 004, Type ROL0
- Meets and exceeds Bellcore standards.
- Pin-testable post-solder joints.
- Translucent residue.
- Capable of printing 12 mil pitch.
64000 SERIES SYNTHETIC NO-CLEAN SOLDER PASTE
- Classification IPC ANSI J-STD-004,Type REL0.
- Meets and exceeds Bellcore standards.
- Translucent, protective post-solder residue.
- Pin-testable post-solder joints. General residue
levels of 2.5 3.3. In proper conditions, can
be as low as 1.1. - Capable of printing 12 mil pitch.
78000 SERIES WATER-SOLUBLE SOLDER PASTE
- Passes Bellcore
- Passes IPC
- Residues are truly water-soluble.
- Post-reflow residues can be left on boards for
extended time and NOT reduce SIR values. - Post-solder residues do not foam in aqueous
cleaning systems. - Capable of printing 12 mil pitch.
89000 SERIES RMA SOLDER PASTE
- Exceptional reflow profiling characteristics.
- Capable of printing 16 mil pitch.
- Superior wetting characteristics.
- Residues can be aqueous cleaned using SyberKleen
2000 Saponifier.
9RECOMMENDED REFLOW PROFILE 63Sn/37Pb and
62Sn/36Pb/2Ag
10REFLOW PROFILE FOR LEAD-FREE
11APPLICATION METHODS
- Screen printing
- Cartridge printing
- Dispensing
12WHAT SETS SUPERIOR SOLDER PASTES APART?
- All are non-halide.
- All have a minimum 12 hour open-time between
printing, placement, and reflow. - All are formulated for high-speed dispensing.
- All No-Clean and RMA pastes can be aqueous
cleaned in Superior SyberKleen 2000 Saponifier . - NO slumping.
- NO tomb-stoning when stencil and reflow profile
are properly set. - NO white residues on PCBs.
- All Paste should be frozen or refrigerated for
storage.
13WHAT SETS SUPERIOR SOLDER PASTES APART? (cont.)
- Consistent rheology, thixotropy, and viscosity
from lot-to-lot. - Consistent, clear, pin-testable residues with all
No-Cleans. - Consistent metal-load due to no pre-thinning or
post-thinning manufacturing process. - 4000 Series Synthetic No-Clean residues act as
protective barrier against humidity and outside
elements. - 8000 Series Water-Soluble residues can be washed
any time after reflow. SIR values remain the
same when PCBs are cleaned three (3) minutes or
three (3) days after reflow.
14SOLDER PASTE STORAGE
- Shelf life for all solder pastes extended
- with freezer-storage first formulations.
- Freezer Storage (0ºC and below) 9-12 months.
- Refrigerator Storage (1-12ºC) 3-9 months.
- Room temperature storage (18-23ºC) 3 months.
15TACKY FLUXES
- 4000 Synthetic No-Clean
- 3000 Conventional No-Clean
- 8000 Water-Soluble
- 9500 High Temperature
- Applications
- BGA Attachment and Repair
- Custom manufacturing applications
- Dispensable applications
- Preform soldering
16WAVE SOLDERING FLUXES
- Flux-types
- No-Clean
- Water-Soluble
- RMA
- Flux-base
- VOC-FREE
- Alcohol-based
- Applications
- 63Sn/37Pb, 96.5Sn/3.5Ag, 99.3Sn/0.7Cu and other
alloys.
17WAVE SOLDERING FLUX APPLICATION METHODS
18NO-CLEAN WAVE SOLDERING FLUXES
- VOC-Free
- No. 420 (Spray or Foam)
- No. 425
- Alcohol-based
- No. 312
- No. 325
- No. 340
- RFE 14Y3N
- All No-Clean fluxes classified as
- IPC ANSI J-STD 004 Type ORL0
- When post-solder cleaning is specified, all
No-Clean fluxes are - water-soluble. No white residues or water-stains.
19WATER-SOLUBLE WAVE SOLDER FLUXES
- Alcohol-based
- No. 84
- RFE 301-26C
- VOC-Free
- No. 32
- All Water-Soluble fluxes classified as
- IPC ANSI J-STD 004 Type ORM1
20ROSIN FLUXES
- Type R No. 97
- Type RMA No. 99
- Type RA No.100
- Solids content variations are available
- for all fluxes.
21ADDITIONAL PCB ASSEMBLY PROCESS PRODUCTS
- SyberGelTM and SyberLiquidTM
- Hand solder, repair and rework gel or liquid that
act as flux and cleaner. - Superior SyberKleen 2000 Saponifier
- Detergent/saponification solution for aqueous
cleaning systems. - Superior Descaler
- A descaling solution for removing scale residual
build-up in batch and in-line aqueous cleaners. - Superior OMTS
- A test solution of IPA and DI water for PCB
testing in Omega Meters. - Superior Dross Reducer
- Powder for dross and oxidation removal from
solder bath to extend solder life.
22COMPONENT TINNING PRECLEANERS FLUXES
- Lead tinning for semiconductor, component, and
fuse leads. - Fluxes formulated for Tin/Lead,
Lead-Free, and fusible alloys. - Base Metals
- Copper
- Nickel
- Alloy 42
- Alloy 51
- Kovar
- Other specialty alloys
23SEMICONDUCTOR AND COMPONENT LEAD PRE-CLEANERS
- Copper Pre-Cleaner
- VOC-Free, non-hazardous, OA formulation.
- Light, pink color that changes if pH exceeds a
3.5 reading. - Nickel Pre-Cleaner
- A high activity nickel cleaner that contains no
sulfuric acid.
24DIFFERENT FLUXES FOR DIFFERENT APPLICATIONS
- VOC-FREE, HALIDE
- No. 30, No. 30DS, No. 40MM4, No. 43
- ALCOHOL-BASED HALIDE
- No. 45, No. 48, No. 48S
- VOC-FREE, NON-HALIDE
- 430 Series
- ALCOHOL-BASED, NON-HALIDE
- No. 435, No. 435 31, No. 91
25WIRE TINNING FLUXES
- No-Clean Small gage (14-22) automatic or manual
cut/strip/tin operations. - VOC-Free No. 425
- Alcohol-based No. 325, No. 334.
- Water-soluble Large gage (2-12) wires Copper
and brass crimped terminal wires. - VOC-Free No. 30
- Alcohol-based No. 45
- Applications
- Automotive, Industrial, and Appliances.
26SUPERIOR MANUFACTURES QUALITY SOLDER PASTES AND
FLUXES. OUR BUSINESS IS SOLVING PROBLEMS