Microsystem Integration Methodology

1
Microsystem Integration Methodology

• From Concept to Proof-of-Concept

Hisham El-Masry September 24th, 2009
2
CMC Microsystems

• An organization with a 25-year history of
  stimulating RD
• Discovery (leading to publications) and
• Innovation (leading to products)
• Involving micro- and nano-scale technologies
• Through delivery of research infrastructure
  (tools, IP, technology, assembly and fabrication
  process, packaging, test equipment and services)
• A path to commercialization

CMC enables and enhances the
competitiveness of Canadian industry and
researchers through innovation in the development
and application of microsystems.
3
Microsystems

• Microsystems are comprised of a number of
  technologies integrated together with embedded
  intelligence and wireless network connectivity,
  to achieve the smallest, lowest power, highest
  performance solutions to a wide variety of
  problems
• CMC supports development of microsystems by
  providing infrastructure and deliverables for
  Design, Make, and Test

4
Sample Microsystems
Neural Sensing System Dr. R. Genov U. Toronto
Lab-On-Chip System Dr. K. Kaler U. Calgary
Vital Sign Monitoring System Dr. B Kaminska Simon
Fraser
5
Design for Integration

• Integration constraints should be compensated in
  design stage
• Constraints include inter-component functionality
  and manufacturing decisions
• Functional constraints
• Signal conditioning
• Signal energy conversion
• Manufacturing constraints
• Material properties electrical, mechanical,
  thermal, chemical, biological
• Fabrication process etching process, deposition
  process, surface/bulk post processing
• Assembly Flip chip, Interposer, Through Silicon
  Via
• Packaging consider parasitics, cavity size,
  bonding arrangement and pitch
• Decision of monolithic and/or hybrid integration
  determines emphasis of constraints on final device

6
Functional Constraints Heterogeneous Co-Design
Microelectronics Methodology
MEMS/Microfluidics Methodology
MICROSYSTEM METHODOLOGY AND CAD DESIGN ENVIRONMENT
CAD Design Environment
Training and Tutorials
Training and Tutorials
CAD Design Environment
Optoelectronics Methodology
7
Methodology - Monolithic
System level Modeling
Functional model
Functional model
DESIGN
Device model
Device model
Layout
Layout
Fabrication
MAKE
Assembly
Packaging
Physical Validation
TEST
Functional Validation

• Monolithic integration involves 2 disparate
  devices fabricated on same substrate
• Design for Integration constraints mainly from
  material properties and fabrication process

8
Methodology - Hybrid
System level Modeling
Functional model
Functional model
Functional model
DESIGN
Device model
Device model
Device model
Layout
Layout
Layout
Fabrication
Fabrication
MAKE
Assembly
Packaging
TEST
Physical Validation
Functional Validation

• Hybrid integration involves 2 disparate devices
  fabricated on different substrates but assembled
  and/or packaged together for joint operation
• Design for Integration constraints mainly from
  assembly and packaging

9
Component Methodology
DESIGN
MAKE
MNT
TEST
10
Proof of Concept Environment (PCE)

• CMC standardized environments for microsystem
  development, characterization and validation
• Incorporates platform technology, and development
  system modules, including packaging, assembly,
  and planar chip-scale technologies
• Interoperable system, hybrid and monolithic
  integration technologies
• User-configurable modules (useful for design of
  devices and of systems)
• Means of providing embedded software support in a
  defined architecture
• Pre-validated components for easy
  integration/customization
• Reference designs
• CAD tools for modeling components at the system
  level with the PCE, as well as controlling the
  operation of the physical system

11
PCE Example MEMS/FPGA Platform

• Bench-top, rapid development platform for
  MEMS-based microsystems
• Incorporates application development with custom
  MEMS devices (co-design of MEMS and
  microelectronics/ESW)
• Intelligence sensing/actuation
• Feedback loop control, signal processing
• Once validated, can lead to miniaturization of
  complete device

12
PCE Example MEMS/FPGA Platform
Behavioral Simulation Model
MATLAB
System Level Design (MEMS Pro, Coventor, Matlab)
MATLAB
Device Level Design (MEMS Pro, Tanner, Coventor)
Xilinx tools
Matlab, Xilinx tools
Xilinx tools
Specifications
Physical Level Design (ANSYS, COMSOL, MEMS Pro,
Coventor)
MEMS Prototype
Process Level Design (MEMS Pro, Coventor)
Device Validation
Microsystems Rapid-Prototype
Proof of Concept, miniaturization
13
PCE Example MEMS/FPGA Platform
Feedback Capacitive sensor board
/-10V
/-200V
Socket
Application/ User Interface System Level
Modeling CAD tools CoventorWare, MEMS Pro,
Simulink, Xilinx development software
Embedded SW and Digital/ System Amirix AP1000
Signal Conversion (A/D, D/A) General Standards
(8-Channel, 2 MSPS, analog-in 4-channel, 1
MSPS, analog-out)
Signal Amplification Tabor 9400 4-Channel, 300V
p-p
Experimental MEMS Component Custom built, HV
Fixture for 68 PGA package
24/09/2009
13
14
PCE Example Compact Wireless Microsystem

• Generic, miniaturized wireless microsystem
  template developed by CMC to allow integration of
  COTS components
• Template for functional prototypes of ZigBee
  wireless-enabled microsystems
• Deliverable Includes
• Verified design file describing component set and
  circuit layout
• Monitor Program software interface tool for
  developing application-specific software

15
PCE Example Compact Wireless Microsystem

• Component Set
• Master processor module (TI cc2430)
• Foundation module (system interface and data
  communication) 20 pin header, serial port level
  translation to RS232, multiple power options
• Power module Coin cell lithium rechargeable
  battery, local capacitors for burst power, boost
  converter
• Sensor module 3-axis linear accelerometer,
  1-axis gyroscope
• A/D conversion 6-channel signal selector, 16
  bit micropower A/D, 12-bit programmable window
  comparator
• Low-Pass Filter input filter module and
  amplifier, 4 channel input (0-3V)
• Shield module ground plane to shield low level
  signals from MPU and RF signals

16
PCE Example Compact Wireless Microsystem
17
PCE Example Compact Wireless Microsystem
Sensor head
IDC20
3-axis accelerometer
Data acquisition
Master processor and radio
reverse side view
chip antenna
EMR shield layer
18
PCE Example Microfluidic Carrier Platform

• The platform mediates or carries the
  electrical, optical and fluidic signals that
  comprise a microfluidic-based microsystem
• Consists of 6 main modular blocks
• Fluidic interface for dispensing and flow control
• Modular optical analysis functionalities
• Packaging and fixturing for electrical and
  fluidic interface to microfluidic chip to a
  driver subsystem
• Subsystem driver for microfluidic chip
• Chip design and fabrication services which offer
  user-designed functionalities for channel
  microfluidics
• Integration of these capabilities into a
  prototype system environment for co-processing
  and microsystem level prototyping

19
PCE Example Microfluidic Carrier Platform
Optical Module
Driver Subsystem
Data management
Data Management
(ADC)
(ADC)
Function
Function
HV AMP
HV AMP
Fluidic
Fluidic
generator
Generator
Interface
Interface
Pump, valves
flow metering
Fixturing
FPGA
FPGA
Benchtop PC
Board
Board
Microsystem level core
20
PCE Example Microfluidic Carrier Platform
CMOS ET - Vancouver 2009
21
Conclusion

• Integration constraints must be considered in
  design phase of microsystems development
• Design for Integration considers functional
  interoperability (design), physical
  implementation (make) and validation (test)
  issues in design phase
• Proof of Concept Environments provide framework
  for Design for Integration

22
Comment or Questions

• Hisham El-Masry
• CMC Microsystems
• e-mail elmasry_at_cmc.ca
• Phone [phone]