A Competitive Edge

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A Competitive Edge
Richard Norman President CTO Hyperchip Inc.
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Hyperchip Overview

• Mission To cost-effectively scale the Internet
  with the same reliability and simplicity as
  voice networks.
• Market Telecom Carriers Service Providers
• Technology PBR-1280 Core IP System
• Facilities Montreal, Canada (90) Dulles, VA
  Intl Sales Offices
• Patents Over 90 (in-process and issued)

Core IP System
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Why Canada?

• Canada has
• plenty of electricity, water and living space
• tops UN quality of life index

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Why Canada?

• Canada has
• plenty of electricity, water and living space
• tops UN quality of life index

Minor factors
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Why Canada?

• Canada has
• plenty of electricity, water and living space
• tops UN quality of life index
• Great technical talent
• World-class universities
• A history of leadership in key innovation areas

Minor factors
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Past Super-Stars

• Newsprint Fenerty, 1838 
• Kerosene Gesner, 1846 
• Electric light bulb Woodward, 1874 (sold
  patent to Edison)
• Telephone Bell, 1877 
• Wireless radio Fessenden, 1900 
• Insulin process Banting, Best, Macleod and
  Collip, 1921 
• Snowmobile Bombardier, 1922 
• Television camera Henroteau, 1934
• Heart pacemaker Hopps, 1950 
• Imax Movie System Ferguson, Kroitor and
  Kerr, 1968 
• CANADARM Spar Aerospace/NRC,
  1975 

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Present Leaders

• Graphics
• ATI, Matrox, Discreet Logic, Softimage
• Energy
• Ballard, Electrofuel, CANDU, Hydrogenics,
  Hydro Quebec Ontario Research  
• Telecom
• Nortel, PMC Sierra, Alcatel, Ericsson, RIM,
  Sierra Wireless, Hyperchip, CANARIE
• Photonics
• JDS, Nortel, Innovance, ITF, Bragg, INO, Ottawa
• Biotech
• CIBA, BioPharma, AstraZeneca, McGill spin-offs
• Aerospace
• Bombardier, Pratt Whitney, GE, Rolls Royce,
  CAE, SPAR

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• So what can Canada do to Maintain (and Increase)
  our Competitive Edge?

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The Good Old Days

• History
• Design and production efficiency were key
• Logic hand-crafted by experts
• Gordon Moore made his own glassware!
• Masks, Packaging Test -gt incidentals
• Moores law
• Integration means more and more logic
• Or more and more memory
• But not both at the same time!
• Growing importance of electronics ensured robust
  industry research

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Where We Are Today

• Today
• All the logic is already integrated
• Adding eDRAM, Analog (PLL, SerDes)
• New primitives emerging
• Quantum dots, MOEMS, Lab-on-a-chip, organic
  electronics

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Where We Are Today

• Today
• All the logic is already integrated
• Adding eDRAM, Analog (PLL, SerDes)
• New primitives emerging
• Quantum dots, MOEMS, Lab-on-a-chip, organic
  electronics
• But
• Test already takes more time than design
• Moores 2nd law (Fab) and Masks costs
• Small volume runs suppressed
• ASIC starts actually dropping Year/Year
• Industry research suppressed
• University/Industry collaboration key

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The Crystal Ball

• Future
• Optics will follow electronics integration path
• Materials integration in lithography and in pkg
• GaAs/InP islands on silicon
• Stacked die in package
• Integration will include all combinations
• Logic, memory, analog, RF, optics, MEMs, sensors,
  fluidics, etc.
• An explosion of new uses possible!
• Direct Write / imprint makes low volumes
  practical again
• An explosion of mixed-function designs
• (FPGAs take low and mid-volume LOGIC)
• Radically new possibilities favour universities!

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The Crystal Ball

• Future
• A large number of designs
• Each with a wide variety of feature types
• Equals a massive testing challenge
• Canadian Universities need serious test
  facilities and testing centers-of-excellence
• It is too expensive for everyone to have their
  own
• So the collaboratory strategy crucial