Processing Capability in UCLAs Nanoelectronics Research Facility NRF

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Processing Capability in UCLAs Nanoelectronics
Research Facility (NRF)
Steve Franz, NRF Manager franz_at_nanolab.ucla.edu Te
l 310-206-8923

• INTRODUCTION
• The NRF is a research facility under the
  auspices of UCLAs Electrical Engineering Dept in
  the Henry Samueli School of Engineering
  supporting a wide variety of micro and
  nanofabrication processes. The facility is open
  to UCLA and other University faculty, as well as
  industry for a modest fee. The facility and
  equipment is maintained by a professional staff
  of engineers under the direction of Prof Ming Wu
  in the EE Dept. Training and process assistance
  is provided by the staff as well.
• UCLAs Nanoelectronics Research Facility
  supports a wide range of programs and activities
  including Functional Engineered Nano
  Architectonics Focus Center (FENA, a
  Semiconductor Industry Association initiative for
  nanoscale materials and structures engineering)
  and is also serving as a model and consultant for
  UCLAs collaboration with UC Santa Barbara for
  its new California Nanosystems Institutes
  (CNSI)cleanroom and interdisciplinary laboratory
  now under construction.

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UCLA NRF CHARTER
Establish an interdisciplinary Center of
Excellence for nanoscale fabrication among
UCLA researchers, other universities and
industry Graduate UCLA students with relevant
fabrication experience useful to industry and
further advanced research Share a common-use
facility to reduce research costs and foster
intergroup cooperation Provide a
professionally-managed facility which keeps
current with process trends and equipment
advances
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NRF MEMBER PROFILE
46 Faculty Users 9 Separate Departments
including Bioengineering, Chemistry EE,
MAE, Material Science and Physics 300 Student
users (primarily graduate researchers) Other
University users such as Cal Tech, Riverside,
Irvine and USC About 20 industry users NRF
supports 2 undergraduate fabrication courses
(MEMs and MOS processing classes)
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NRF OPERATIONS
Lab online for over 10 years 6 Full Time
Professional Engineers with over 60 years
experience Hourly Lab Use Fee to cover general
operating cost monitored by commercial badging
system Additional hourly charge for use of
more costly equipment eg vacuum deposition
equipment, SEM and furnaces Online written
procedures, calendar, reservation system,
training lists, email statusing and updates etc
(www.nanolab.ucla.edu) Superuser and staff
training system with 2 step certification for
complex equipment and training coordinator
Lab available 7 days/week, 16 hours/day
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NRF FACILITY
8000 sq ft class 1000 500 sq ft class 100
vertical clean room Vibration-isolated floor,
independently suspended from building Yellow
room lithography area for processing
photosensitive materials High purity Deionized
water system (18M?-cm) on tap at each hood 7
facilitized hoods for safe wet chemical
processing High purity (5 9s) bulk nitrogen
gas delivery system Insitu real time toxic
gas monitoring system with remote toxic gas
bunker with automatic purge panel, orbital-welded
stainless steel lines and double containment
for safe gas handling etc
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NRF PROCESS CAPABILITIES- LITHOGRAPHY
Leica EBL 100 Nanowriter with 100KEV gun, laser
stage and resolution down to 30 nm
Suss MA 6 aligner with top and bottom
alignment and resolution to 0.8 microns
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NRF PROCESS CAPABILITIES-METAL DEPOSITION
2 CHA Mark 40 cryo-pumped e-beam evaporators
with planetary rotation, substrate heat and
6 crucible pockets Sloan 1800-electron-beam
evaporator with substrate heat, cryopumped
chamber and closed loop deposition control
CVC 601 3 target sputter deposition with RF etch
capability
CHA Mark 40 used for Ti, Al, Au, Pt, Ni, Cr and
deposition of many other metals
CVC 601 Sputter Deposition System
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NRF PROCESS CAPABILITIES-THERMAL PROCESSING
2 Modular Process Rapid Thermal Annealers
with pyro or TC control
4 tube furnace bank with oxidation and
LPCVD polysilicon, nitride and LTO
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NRF PROCESS CAPABILITIES-PLASMA DEPOSITION
2 Low Temperature PECVD Dielectric Deposition
Tools for depositing oxides and nitrides of
Si STS Multiplex PECVD Deposition with
stress control and doping capability
Unaxis 790 manual load system
STS MULTIPLEX PECVD with stress control
Unaxis 790 PECVD deposition system
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NRF PROCESS CAPABILITIES-DRY ETCH
3 ICP Etchers STS AOE for Oxide, SLR 770
SF6/C4F8 for Si etch
and Unaxis SLR 770 with BCl3, HBr, CH4 for III-V
compound etching and
metal etching 2 RIE Etchers Oxford 80 and
Technics RIE 800 using F chemistry
for Si oxide and nitride etching
STS AOE ICP Oxide Etcher
Unaxis SLR 770 Bosch ICP Si etcher
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NRF PROCESS CAPABILITIES-METROLOGY
Dektak 6 and 8 surface profilometers with
extended vertical range and topology mapping
capability (Dektak 8) SCI Filmtek 2000
spectrophotometer for measuring thickness and
refractive index of multiple films including SOI,
porous silicon and III-V film stacks.
Prometrix Omnimap RS-35 4 point probe for mapping
sheet resistances. Flexus 2320A film stress
measuring system. Nanospec 210
spectrophotmeter for measuring film thick-
nesses of known refractive index. Gaertner
L116 fixed wavelength ellipsometer M M 6400
microprober with HP 4145 parametric analyzer
Miscelaneous microscopes, video cameras etc
Dektak Profilometer
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NRF PROCESS CAPABILITIES-Hitachi S4700 FE SEM
Hitachi S4700 Field Emission SEM for low
(1-2 KEV) and high resolution (See photo)
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NRF RESEARCH SAMPLING
Photonic Crystal Development Optical Grating
using III-V compounds On-chip wave guides using
spin-on films SiGe and oxynitride studies for
enhanced silicon ICs Micro machined structures
including Integrated IR detectors and
sensors 3 dimensional popup hinged structures
(eg flow sensing) Smart skin for aerodynamic
control surfaces CMOS-integrated, suspended
spiral inductors with low parasitic
capacitance
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NRF RESEARCH SAMPLING
Nanoscale Motors Detection and Identification
of DNA in Microchannels Micro-Nozzle for
Spacecraft Satellite Thrusting Research
Quantum well photoluminescence Spontaneous
emission in photonic crystals Monolithic SOI
based WDM receivers Micro-droplet dispensing
systems RF Liquid switches and microbatteries
High K dielectrics for MOS applications using RTP
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Students operating various equipment