... a thin metal layer (Anchor Metal) consisting of 10nm Cr 25nm Pt is ... FIGURE 1.10 The Plating base layer, consisting of 500nm Cu 50nm Ti is deposited. ...
industrial quality process lines (University process lines cannot offer a stable ... Dual-damascene copper for interconnect. 6 to 9 metal layers for interconnect ...
industrial quality process lines (University process lines. cannot offer a stable yield) ... Gravure anisotrope sans masque additionel. Technologie int gr e ...
News Headlines ... (Auditor General, Australian Government) ... MUMPs Technology or Multi User MEMS processes. MEMS = micro-electro-mechanical systems ...