Micro solder ball on the Ball Grid Array (BGA) Structure ... distance between the solder ball and the probe ... Solder ball with dimension of 0.25 to 0.76 ...
We are also the largest packaging manufacturer Visy are closing the loop ... prepares it for remanufacture into new glass bottles, jars and other glass packaging.
Big Market Research “Eddy-Current Testing Industry“ Size, Share, Industry Trends, Demand, Insights, Analysis, Research, Report, Opportunities, Company Profiles, Forecast