3D IC and 2.5D IC Packaging Market Size, Share, Growth Drivers - Global Forecast to 2028 - PowerPoint PPT Presentation

Title: 3D IC and 2.5D IC Packaging Market Size, Share, Growth Drivers - Global Forecast to 2028


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MarketsandMarkets Presents

3D IC and 2.5D IC Packaging Market Size, Share,
Growth Drivers - Global Forecast to 2028 3D IC
and 2.5D IC Packaging Market by Packaging
Technology (3D Wafer-Level Chip Scale Packaging,
3D TSV and 2.5D), Application (Logic, Memory,
MEMS/Sensors, Imaging Optoelectronics, LED),
End User and Region - Global Forecast to
2028 https//www.marketsandmarkets.com/Market-Rep
orts/3dic-25d-tsv-interconnect-for-advanced-packag
ing-market-130814873.html
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The 3D IC and 2.5D IC packaging market is
estimated to be worth USD 49.3 billion in 2022
and is projected to reach USD 82.0 billion by
2028, at a CAGR of 10.7 during the forecast
period. Growing adoption of high-end computing,
servers, and data centers and miniaturization of
IoT Devices are some of the major opportunities
that lie ahead for the market. The semiconductor
industry business is primarily driven by
applications such as data centers/cloud,
mobility, and the Internet of Things (IoT). The
packaging technique must advance alongside the
scaling of integrated circuit (IC) technology in
order to fulfill the demands of next-generation
information and communication technology (ICT)
systems. Package design and development must
simultaneously meet cost, performance, form
factor, and reliability objectives. In terms of
powering the design, the power density is higher
for a given footprint than for traditional 2D
chips. However, answering reliability issues will
be crucial. Browse in-depth TOC on "3D IC and
2.5D IC Packaging Market" 124 Tables 61
Figures 224 Pages
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Consumer electronics to hold largest market
share among end users in 3D IC and 2.5D IC
packaging market Consumer electronics, by end
user, is expected to hold the largest market
share of the 3D IC and 2.5D IC packaging market.
Increasing memory requirements in consumer
products such as smartphones and tablets are
driving the need for various advanced memories
such as double-data-rate (DDR) dynamic
random-access memory (DRAM), flash memory, and so
on to be integrated. The advanced memory
architectures are driving the demand for the 3D
IC and 2.5D IC packaging market to offer
high-performing, large-capacity, and compact
products. Ask PDF Brochure https//www.marketsan
dmarkets.com/pdfdownloadNew.asp?id130814873 MEMS
/Sensors to register highest CAGR in the 3D IC
and 2.5D IC packaging market during forecast
period The functional components of MEMS are
micro sensors, micro actuators, and
microelectronics. The advanced elements of MEMS
are accelerometers, gyroscopes, digital
compasses, inertial modules, pressure sensors,
humidity sensors, microphones, and smart sensors,
among others. The key requirement in all these
elements and sensors is a miniaturized structure.
Therefore, many sensors have started adopting 3D
IC and 2.5D IC packages. 3D WLCSP to register
highest CAGR in the 3D IC and 2.5D IC packaging
market during forecast period 3D WLCSP is one of
the most compact package types, with increased
functionality and improved thermal performance in
printed circuit boards compared to 3D TSV and
2.5D IC. 3D WLCSP has a simplified process design
for manufacturing 3D ICs, which uses polymers
that can sustain high temperatures, thus
addressing the thermal issue, which is the major
challenge for this market. 3D WLCSP has gained
popularity in space-constrained consumer
electronic applications and other portable
consumer devices as well as industrial products
as it offers cost-effective, small, lightweight,
high-performance semiconductor solutions.
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Asia Pacific held to register highest CAGR in
the 3D IC and 2.5D IC packaging market during
forecast period The Asia Pacific region is one of
the key markets for 3D IC and 2.5D IC packaging
owing to its broad scope in various consumer
electronics applications, particularly in
smartphones and tablets. This is mainly because
of the high population density in the region,
making it the largest potential market for 3D IC
and 2.5D IC packaging among the four major
regions. Request Free Sample Pages https//www.m
arketsandmarkets.com/requestsampleNew.asp?id13081
4873 Key Market Players The major players in the
3D IC and 2.5D IC packaging Companies include.
The key players such as Samsung (South Korea),
Taiwan Semiconductor Manufacturing Company, Ltd.
(Taiwan), Intel Corporation (US), ASE Technology
Holding Co., Ltd. (Taiwan), Amkor Technology
(US), Broadcom (US), Texas Instruments Inc. (US),
United Microelectronics Corporation (Taiwan),
JCET Group Co., Ltd. (China) and Powertech
Technology Inc. (Taiwan). These companies have
used both organic and inorganic growth strategies
such as product launches, acquisitions, and
partnerships to strengthen their position in the
market.
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3D IC and 2.5D IC Packaging Market by Region
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Driver Growing demand for consumer electronics
and gaming devices With the latest technological
advancements, there are many new gadgets coming
up in the market, such as e-book readers, gaming
devices, tablet computers, 3D smart glass,
augmented reality, and virtual reality products
which demand high-performance electronic
components. 3D IC packaging technology has helped
bridge the processor memory performance gap by
shortening the critical path and reducing the
latency. It also allows scaling to continue
efficiently by moving the focus from device-level
scaling to circuit- and system-level
scaling. Opportunity Rising number of smart
infrastructure and smart city projects 3D IC
packaging can play a significant role in the
development and implementation of smart city
technology. Smart cities rely on a variety of
electronic devices, sensors, and systems to
collect and analyze data in real time, enabling
better decision-making and more efficient
resource management. By using 3D IC packaging,
these devices and systems can be made smaller and
more powerful and energy efficient. This helps
reduce the overall cost and size of smart city
infrastructure while improving performance and
reliability. Challenge  Reliability challenges
with 3D IC packaging The semiconductor industry
business is primarily driven by applications such
as data centers/cloud, mobility, and the Internet
of Things (IoT). The packaging technique must
advance alongside the scaling of integrated
circuit (IC) technology in order to fulfill the
demands of next-generation information and
communication technology (ICT) systems. Package
design and development must simultaneously meet
cost, performance, form factor, and reliability
objectives. In terms of powering the design, the
power density is higher for a given footprint
than for traditional 2D chips. However, answering
reliability issues will be crucial.
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