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    3D Interconnect: Architectural Challenges and Opportunities PowerPoint PPT Presentation

Title: 3D Interconnect: Architectural Challenges and Opportunities - PowerPoint PPT Presentation

Description: Introspective 3D Chips , Proceedings of the Twelfth ... On-chip Latency improved, Bandwidth could improve more. What about real wires? What about apps? ... – PowerPoint PPT presentation

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